The recent rapid development of multi-functional electronic devices and 5G technology, along with convenient living, inevitably generates a large amount of electromagnetic pollution. Therefore, the development of more efficient electromagnetic interference (EMI) shielding materials is necessary. In this study, Cu-Ag MOD inks with various Ag contents were synthesized by mixing synthesized Cu MOD ink and Ag MOD ink. These Cu-Ag inks were coated on a polyimide film and sintered using intensive pulsed light (IPL) to obtain the coated thin films. The properties of the coated thin films were investigated by SEM, XRD, UV-Vis absorption, resistivity, impedance, and the EMI shielding effectiveness (SE) was measured. The thin film coated with Cu-Ag ink containing 2.5 wt% Ag and sintered with IPL energy of 60 J/cm2 achieved EMI SE higher than 50.