:: Applied Chemistry for Engineering ::

About US +
- Aims and Scope
- Editorial Board
For Contributors +
Journal Search +

Journal Search Engine

Investigating the Effect of Photoinitiator Types and Contents on the Photocuring Behavior of Photocurable Inks and Their Applications for Etching Resist Inks

Bo-Young Kim, Subin Jo, Gwajeong Jeong, Seong Dae Park, Jihoon Kim, Eui-Keun Choi, Myong Jae Yoo, Hyunseung Yang

Applied Chemistry for Engineering :: Vol.34 No.4 pp.444-449

DOI:https://doi.org/10.14478/ace.2023.1050
Open abstract
Effect of Etching Treatment of SAPO-34 Catalyst on Dimethyl Ether to Olefins Reaction

Kang Song, Young-Chan Yoon, Chu-Sik Park, Young-Ho Kim

Applied Chemistry for Engineering :: Vol.32 No.1 pp.20-27

DOI:https://doi.org/10.14478/ace.2020.1091
Open abstract
Electrochemical Performance of Hollow Silicon/Carbon Anode Materials for Lithium Ion Battery

Applied Chemistry for Engineering :: Vol.27 No.4 pp.444-448

DOI:
Open abstract
Design of Pretreatment Process of Lead Frame Etching Wastes Using Reduction-Oxidation Method

Seung Bum Lee, Gil Song Jeon, Rae Yoon Jung,In Kwon Hong

Applied Chemistry for Engineering :: Vol.27 No.1 pp.21-25

DOI:
Open abstract
Non-HF Type Etching Solution for Slimming of Flat Panel Display Glass

Applied Chemistry for Engineering :: Vol.27 No.1 pp.101-109

DOI:
Open abstract
RESARCH PAPERS : Homeogenous Etched Pits on the Surface of Nb by Electrochemical Micromachining

Kyung Min Kim

Applied Chemistry for Engineering :: Vol.25 No.1 pp.53-57

DOI:
Open abstract
Original article : Formation of Aluminum Etch Tunnel Pits with Uniform Distribution Using UV-curable Epoxy Mask

Chang Hyun Park

Applied Chemistry for Engineering :: Vol.24 No.5 pp.562-565

DOI:
Open abstract
RESEARCH PAPERS : Regeneration of Waste Ferric Chloride Etchant Using HCl and H2O2

Yong Sug Tak

Applied Chemistry for Engineering :: Vol.24 No.1 pp.67-71

DOI:
Open abstract
Research papers : Controllable Patterning of an Al Surface by a PDMS Stamp

Ga Yun Park

Applied Chemistry for Engineering :: Vol.23 No.5 pp.501-504

DOI:
Open abstract
Research Papers : Organic-inorganic Hybrid Materials for Spin Coating Hardmask

Je Jeong Yu

Applied Chemistry for Engineering :: Vol.22 No.2 pp.230-234

DOI:
Open abstract
Research Papers : Glass Thinning by Fluoride Based Compounds Solution with Low Hydrofluoric acid Concentration

Ho Tae Kim

Applied Chemistry for Engineering :: Vol.20 No.5 pp.557-560

DOI:
Open abstract
Research Papers : Study on Soft Etching Material Development to Improve Peel Strength between Surface of Copper and Solder Resist Ink

Yun Jae Kang

Applied Chemistry for Engineering :: Vol.20 No.2 pp.172-176

DOI:
Open abstract
Research Papers : Notching Phenomena of Silicon Gate Electrode in Plasma Etching Process

Won Gyu Lee

Applied Chemistry for Engineering :: Vol.20 No.1 pp.99-103

DOI:
Open abstract
Research Papers : Etch Characteristics of Zinc Oxide Thin Films in a Cl2/Ar Plasma

Su Ryun Min

Applied Chemistry for Engineering :: Vol.18 No.1 pp.24-28

DOI:
Open abstract
Invited Review Article : Electrochemical Properties of Metal Aluminum and Its Application

Yong Sug Tak

Applied Chemistry for Engineering :: Vol.17 No.4 pp.335-342

DOI:
Open abstract
Notes : Etch Characteristics of NbOx Nanopillar Mask for the Formation of Si Nanodot Arrays

Ik Hyun Park

Applied Chemistry for Engineering :: Vol.17 No.3 pp.327-330

DOI:
Open abstract
Research Papers : IR Study on the Adsorption of Carbon Monoxide on Silica Supported Platinum

Sang Youn Park

Applied Chemistry for Engineering :: Vol.15 No.7 pp.702-707

DOI:
Open abstract
Flame Retardency and Thermal Resistance of NBR Materials Using Aluminum Etching Byproduct

Kyung Hwan Kim

Applied Chemistry for Engineering :: Vol.11 No.8 pp.855-860

DOI:
Open abstract
RESEARCH PAPERS : Synthesis of Aminated Poly ( ether sulfone ) as Anion Exchanger and its NO Gas Adsorption

W . K . Son

Applied Chemistry for Engineering :: Vol.10 No.6 pp.857-862

DOI:
Open abstract
A Study on the Heat Resistance and Polarization Characteristics of Poly ( vinyl alcohol ) - I2 Complex Films Prepared with a Potassium iodide

Se Young Oh

Applied Chemistry for Engineering :: Vol.10 No.4 pp.603-607

DOI:
Open abstract

1|2